Price List for Low-Loss Co-packaged Photonics for Data Center Interconnects

Co-packaged optics (CPO) solutions for data center interconnects currently range from hundreds to thousands of dollars per module, depending on data rate, integration level, and component type.Market Pricing EstimatesThe global co-packaged optics market was valued at approximately USD 1.8 billion in 2025, with projections to reach USD 3.2 billion by 2034, reflecting a CAGR of 5.5% .Another market analysis estimates the CPO market at USD 70.2 million in 2025, with a projected CAGR of 47.12% from 2025 to 2033, driven by high-speed interconnect demand and AI workloads .Individual CPO modules, particularly low-loss optical engines and photonic integrated circuits (PICs), are priced higher for 800G–1.6T and above data rates, reflecting the complexity of integration and silicon photonics technology .Cost DriversIntegration Level: Fully integrated CPO modules combining optical transceivers, PICs, and ASICs are more expensive than near-packaged or pluggable solutions due to advanced 3D integration, hybrid bonding, and thermal management requirements .Data Rate: Modules supporting 200G/channel, 400G–800G, or 1.6T links command higher prices because of tighter tolerances, low insertion loss, and high-speed signal integrity demands .Component Type: Lasers, modulators, and high-performance PICs are significant contributors to module cost. Silicon photonics integration reduces some costs but requires specialized manufacturing .Volume and Supply Chain: Large-scale deployments in hyperscale data centers can reduce per-unit costs, but component shortages (e.g., lasers, photonic chips) can temporarily increase prices .Technology Maturity: Early adoption of co-packaged optics involves higher upfront capital expenditure for new manufacturing lines and testing equipment, which is reflected in module pricing .Practical ConsiderationsLow-loss CPO modules are designed to minimize PCB trace insertion loss and crosstalk, often achieving